The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2012
Filed:
Feb. 09, 2010
Yu-hsiang Chen, Taipei, TW;
Cheng-i LU, Taipei, TW;
Min-nan Yeh, Taipei, TW;
Chi-hsiang Chang, Taipei, TW;
Yu-Hsiang Chen, Taipei, TW;
Cheng-I Lu, Taipei, TW;
Min-Nan Yeh, Taipei, TW;
Chi-Hsiang Chang, Taipei, TW;
Cheng Uei Precision Industry Co., Ltd., New Taipei, TW;
Abstract
An optical sensor package structure includes a substrate, a metal plate, an optical sensing chip, a plurality of bonding wires and a lens module. The substrate includes a top surface, a bottom surface and a hole penetrating the top surface and the bottom surface. The metal plate covers the hole from the bottom surface of the substrate. The optical sensing chip is received in the hole and mounted on the metal plate. The bonding wires interconnect the optical sensing chip and the top surface of substrate. The lens module is covering on the hole and mounting on the top surface of the substrate to enclose the optical sensing chip and the bonding wires. Because the optical sensing chip is received in the hole of the substrate, the height of the optical sensor package structure can be reduced to adapt to a compact size electrical device.