The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2012

Filed:

Feb. 12, 2010
Applicants:

Chang Ho Cho, Anseong-si, KR;

Sung Hyun Kim, Daejeon, KR;

Raisa Kharbash, Daejeon, KR;

Keon Woo Lee, Daejeon, KR;

Dong Kung OH, Daejeon, KR;

Won Jin Chung, Daejeon, KR;

Sang Kyu Kwak, Daejeon, KR;

Chang Soon Lee, Daejeon, KR;

Inventors:

Chang Ho Cho, Anseong-si, KR;

Sung Hyun Kim, Daejeon, KR;

Raisa Kharbash, Daejeon, KR;

Keon Woo Lee, Daejeon, KR;

Dong Kung Oh, Daejeon, KR;

Won Jin Chung, Daejeon, KR;

Sang Kyu Kwak, Daejeon, KR;

Chang Soon Lee, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/004 (2006.01); G03F 7/028 (2006.01); C07D 209/82 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a photoactive compound of a novel structure represented by Chemical Formula 1 below In Chemical Formula 1, Rand R, R, and A are as defined in the specification, and a photosensitive resin composition comprising the same. The photoactive compound of the present invention comprises a nitro group and a phosphonate structure and thus exhibits excellent sensitivity through efficient absorption for UV light, excellent compatibility between the photoactive compound and the alkali-soluble binder resin, and an improved solubility of the photosensitive resin composition. Furthermore, the photosensitive resin composition of the present invention has excellent residual film thickness and mechanical strength characteristics and heat-resistant, chemical-resistant, and development-resistant properties. Accordingly, the photosensitive resin composition of the present invention is advantageous in hardening the column spacers of liquid crystal displays, an overcoat, and passivation materials and also advantageous in a high-temperature process characteristic.


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