The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2012
Filed:
Aug. 27, 2009
Masato Nomiya, Moriyama, JP;
Satoshi Asakura, Echizen, JP;
Tatsuya Ueda, Okayama, JP;
Akira Baba, Fukui, JP;
Masato Nomiya, Moriyama, JP;
Satoshi Asakura, Echizen, JP;
Tatsuya Ueda, Okayama, JP;
Akira Baba, Fukui, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
In a multilayer ceramic substrate manufactured by a non-shrinking process, a bonding strength of an external conductive film formed on a primary surface of the multilayer ceramic substrate is increased. After a laminate of a multilayer ceramic substrate is formed from first ceramic layers and second shrinkage suppressing ceramic layers, and an underlayer is formed along one primary surface of the multilayer ceramic substrate, an external conductive film is formed on the underlayer. A non-sintering ceramic material powder in a non-sintered state is included in both the external conductive film and the underlayer, and this non-sintering ceramic material powder is fixed due to diffusion of a glass component from the first ceramic layers.