The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2012
Filed:
May. 29, 2009
Douglas W. Glover, Dauphin, PA (US);
David W. Helster, Dauphin, PA (US);
Timothy R. Minnick, Enola, PA (US);
Chad W. Morgan, Woolwich Township, NJ (US);
Evan C. Wickes, Harrisburg, PA (US);
Douglas W. Glover, Dauphin, PA (US);
David W. Helster, Dauphin, PA (US);
Timothy R. Minnick, Enola, PA (US);
Chad W. Morgan, Woolwich Township, NJ (US);
Evan C. Wickes, Harrisburg, PA (US);
Tyco Electronics Corporation, Berwyn, PA (US);
Abstract
High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.