The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2012

Filed:

Nov. 24, 2010
Applicants:

Dai Ito, Kiyosu, JP;

Takayoshi Honda, Nagoya, JP;

Mitsuhiko Mizuno, Kasugai, JP;

Inventors:

Dai Ito, Kiyosu, JP;

Takayoshi Honda, Nagoya, JP;

Mitsuhiko Mizuno, Kasugai, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic device has: a connector having plural kinds of terminals with respectively different cross section shapes; and a substrate having a plurality of through-holes with lands formed therein. In the electronic device, a width Wof an insertion portion of the first terminal, a width Wof an insertion portion of the second terminal, a land-inclusive hole diameter Dof the first through-hole, and a land-inclusive hole diameter Dof the second through-hole are configured to fulfill conditions of W<W, D<D, and W−W>D−D, for the improvement of connection reliability between the land and the terminal while restraining dropping of reflow solder in a connector mounting process.


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