The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2012

Filed:

Aug. 19, 2009
Applicants:

Hitoshi Matsushima, Ryugasaki, JP;

Tadakatsu Nakajima, Kasumigaura, JP;

Takayuki Atarashi, Tsuchiura, JP;

Yoshihiro Kondo, Tsuchiura, JP;

Hiroyuki Toyoda, Hitachinaka, JP;

Tomoo Hayashi, Hitachinaka, JP;

Akio Idei, Hadano, JP;

Shigeyasu Tsubaki, Odawara, JP;

Takumi Sugiura, Kashiwa, JP;

Yasuhiro Kashirajima, Tokyo, JP;

Inventors:

Hitoshi Matsushima, Ryugasaki, JP;

Tadakatsu Nakajima, Kasumigaura, JP;

Takayuki Atarashi, Tsuchiura, JP;

Yoshihiro Kondo, Tsuchiura, JP;

Hiroyuki Toyoda, Hitachinaka, JP;

Tomoo Hayashi, Hitachinaka, JP;

Akio Idei, Hadano, JP;

Shigeyasu Tsubaki, Odawara, JP;

Takumi Sugiura, Kashiwa, JP;

Yasuhiro Kashirajima, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.


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