The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2012
Filed:
Jul. 16, 2010
William Eddie Armstrong, Redwood City, CA (US);
Michael Shannon Mccorquodale, Ann Arbor, MI (US);
Vidyabhusan Gupta, Palo Alto, CA (US);
Justin O'day, Detroit, MI (US);
Nader Fayyaz, Kitchener, CA;
Gordon Carichner, Saline, MI (US);
William Eddie Armstrong, Redwood City, CA (US);
Michael Shannon McCorquodale, Ann Arbor, MI (US);
Vidyabhusan Gupta, Palo Alto, CA (US);
Justin O'Day, Detroit, MI (US);
Nader Fayyaz, Kitchener, CA;
Gordon Carichner, Saline, MI (US);
Intergrated Device Technologies, inc., San Jose, CA (US);
Abstract
A reference signal generator includes an integrated circuit substrate having a semiconductor resonator therein. The resonator includes an inductor extending adjacent a first surface of the integrated circuit substrate. A vertically-stacked composite of at least first and second electrically insulating dielectric layers is provided on the integrated circuit substrate. The vertically-stacked composite covers a portion of the first surface, which extends opposite the inductor. A first electrically conductive shielding layer is provided on a portion of the second electrically insulating dielectric layer extending opposite the inductor. The first electrically conductive shielding layer may encapsulate exposed portions of the first and second electrically insulating dielectric layers. The shielding layer may operate as an electromagnetic shield between the inductor and an external structure, such as an integrated circuit package, and also shield against environmental contamination (e.g., external moisture penetration).