The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2012

Filed:

Jan. 16, 2009
Applicants:

Yuji Morikawa, Himeji, JP;

Yoshihiko Matsui, Himeji, JP;

Akinobu Otaka, Hyogo, JP;

Takeshi Higuchi, Hyogo, JP;

Kensuke Fujimura, Nasu-machi, JP;

Inventors:

Yuji Morikawa, Himeji, JP;

Yoshihiko Matsui, Himeji, JP;

Akinobu Otaka, Hyogo, JP;

Takeshi Higuchi, Hyogo, JP;

Kensuke Fujimura, Nasu-machi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 3/68 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heater has a smooth heating surface and a recess formed on a second surface opposite to the heating surface. The recess is formed between opposite side walls in a lengthwise direction of the heater. Formation of the recess improves the electrical resistance of the heater and the opposite side walls reinforce the heater and prevent deformation of the heater when it is subjected to high temperatures in a semiconductor wafer processing device. The heater has substantially the same width along its lengthwise direction. This improves the control of heat pattern design, because the terminal end portions do not have an expanded shape.


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