The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2012

Filed:

Nov. 21, 2007
Applicants:

Shigeyoshi Yoshida, Sendai, JP;

Koichi Kondo, Sendai, JP;

Hiroshi Ono, Sendai, JP;

Satoshi Arai, Sendai, JP;

Tadashi Kubodera, Ebina, JP;

Inventors:

Shigeyoshi Yoshida, Sendai, JP;

Koichi Kondo, Sendai, JP;

Hiroshi Ono, Sendai, JP;

Satoshi Arai, Sendai, JP;

Tadashi Kubodera, Ebina, JP;

Assignee:

NEC Tokin Corporation, Sendai-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multilayer printed circuit board includes an inner magnetic layer essentially consisting of magnetic material. The inner magnetic layer may be formed by an action of chemical bond or van der Waals force. The inner magnetic layer may comprise a plurality of magnetic units, each of which provides magnetism, and may be formed by magnetically coupling the magnetic units with each other by using a strong interaction. The inner magnetic layer may essentially consist of a ferrite film. The ferrite film may be formed directly on the inner conductive layer by means of an electroless plating method. The ferrite film may essentially consist of an oxide metal composition, the metal composition being represented by the formula of FeNiZnCo, where: a+b+c+d=3.0; 2.1≦a≦2.7; 0.1≦b≦0.3; 0.1≦c≦0.7; and 0≦d≦0.15.


Find Patent Forward Citations

Loading…