The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2012
Filed:
Apr. 27, 2010
David Christopher Graham, Lexington, KY (US);
Gary Anthony Holt, Jr., Lexington, KY (US);
Jonathan Harold Laurer, Boone, NC (US);
Johnny Dale Massie, Ii, Lexington, KY (US);
Melissa Marie Waldeck, Lexington, KY (US);
Sean Terrence Weaver, Union, KY (US);
Rich Wells, Westerville, OH (US);
David Christopher Graham, Lexington, KY (US);
Gary Anthony Holt, Jr., Lexington, KY (US);
Jonathan Harold Laurer, Boone, NC (US);
Johnny Dale Massie, II, Lexington, KY (US);
Melissa Marie Waldeck, Lexington, KY (US);
Sean Terrence Weaver, Union, KY (US);
Rich Wells, Westerville, OH (US);
Lexmark International, Inc., Lexington, KY (US);
Abstract
Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).