The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2012
Filed:
Mar. 30, 2009
Yoshihiro Tomura, Osaka, JP;
Kentaro Kumazawa, Osaka, JP;
Takayuki Higuchi, Osaka, JP;
Koujiro Nakamura, Osaka, JP;
Yoshihiro Tomura, Osaka, JP;
Kentaro Kumazawa, Osaka, JP;
Takayuki Higuchi, Osaka, JP;
Koujiro Nakamura, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A flip-chip mounting apparatus has a shield film () on the side of a pressurizing film () of a tool protection sheet (). When a semiconductor chip () is heated and pressurized via the tool protection sheet (), the pressurizing film () is released from a mold by a sheet fixing jig (), and is expanded by a pressurizing/heating tool () to abut against an insulating resin film () protruding from the periphery of the semiconductor chip () and cure the insulating resin film () with an external pressure being applied.