The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2012
Filed:
May. 26, 2003
Yoshimitsu Ikari, Hyogo, JP;
Hiroshi Tamagaki, Hyogo, JP;
Toshimitsu Kohara, Hyogo, JP;
Kobe Steel, Ltd., Kobe-shi, JP;
Abstract
The present invention provides a method for reactive sputtering in which a reactive sputtering apparatus including a sputtering vaporization sourceprovided with a metal target disposed in a vacuum chamber, a sputtering power sourceto drive the sputtering vaporization source, and an introduction mechanismto introduce an inert gas for sputtering and a reaction gas for forming a compound with sputtered metal into the vacuum chamberis used, and reactive sputtering film formation is performed on a substratedisposed in the above-described vacuum chamber, wherein the method includes the steps of performing constant-voltage control to control the voltage of the above-described sputtering power sourceat a target voltage Vs and, in addition, performing target voltage control at a control speed lower than the speed of the above-described constant-voltage control, the target voltage control operating the above-described target voltage Vs in order that the spectrum of plasma emission generated forward of the above-described sputtering vaporization sourcebecomes a target value.