The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2012
Filed:
May. 05, 2011
Ji Sun Lee, Cheonan-Si, KR;
Hong Sick Park, Suwon-Si, KR;
Jong Hyun Choung, Hwaseong-Si, KR;
Sun Young Hong, Yongin-Si, KR;
Bong Kyun Kim, Incheon, KR;
Byeong Jin Lee, Yongin-Si, KR;
Byung Uk Kim, Incheon, KR;
Jong Hyun Jeong, Incheon, KR;
Suk Ii Yoon, Incheon, KR;
Seong Bae Kim, Incheon, KR;
Sung Gun Shin, Incheon, KR;
Soon Beom Huh, Incheon, KR;
SE Hwan Jung, Incheon, KR;
Doo Young Jang, Incheon, KR;
Ji Sun Lee, Cheonan-Si, KR;
Hong Sick Park, Suwon-Si, KR;
Jong Hyun Choung, Hwaseong-Si, KR;
Sun Young Hong, Yongin-Si, KR;
Bong Kyun Kim, Incheon, KR;
Byeong Jin Lee, Yongin-Si, KR;
Byung Uk Kim, Incheon, KR;
Jong Hyun Jeong, Incheon, KR;
Suk II Yoon, Incheon, KR;
Seong Bae Kim, Incheon, KR;
Sung Gun Shin, Incheon, KR;
Soon Beom Huh, Incheon, KR;
Se Hwan Jung, Incheon, KR;
Doo Young Jang, Incheon, KR;
Abstract
The present invention provides a stripping composition and a stripping method capable of easily stripping a color resist or an organic insulating film formed on a substrate to reuse the substrate when defects are found during a process of forming the color filter or organic insulating film on the substrate. In one embodiment, the stripping composition includes about 0.5 to about 45 wt % of hydroxide compound, about 10 to about 89 wt % of alkyleneglycolalkylether compound, about 5 to about 45 wt % of alkanolamine compound, and about 0.01 to about 5 wt % of inorganic salt compound. Advantageously, the stripping process can be performed without damaging a thin film transistor of a bottom substrate while removing the color resist or organic insulating film.