The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8162673 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 24, 2012

Filed:

Sep. 05, 2010
Applicant:

Song-ya Chen, Shenzhen, CN;

Inventor:

Song-Ya Chen, Shenzhen, CN;

Assignees:

Fu Tai Hua Industry (Shenzhen) Co., Ltd., ShenZhen, Guangdong Province, CN;

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An EMI spring contact for shielding EMI comprises a first section having a first end and a second end opposite to the first end, a second section connected to the first section and extending up and angularly from the first end of the first section, a third section connected to the second section and extending down from the second section, and a fourth section connected to the third section. An acute angle is formed between the first and second sections, and a first through hole is defined in the second section. The fourth section extends up and angularly from the third section through the first through hole of the second section and is movably received in the first through hole.


Find Patent Forward Citations

Chen, Song-Ya. (2012). Electromagnetic interference spring contact for shielding electromagnetic interference and electronic device using same (U.S. Patent No. 8162673). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8162673

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