The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2012
Filed:
Jun. 03, 2009
Kuo-len Lin, Wugu Township, Taipei County, TW;
Chen-hsiang Lin, Wugu Township, Taipei County, TW;
Hwai-ming Wang, Wugu Township, Taipei County, TW;
Ken Hsu, Wugu Township, Taipei County, TW;
Chih-hung Cheng, Wugu Township, Taipei County, TW;
Kuo-Len Lin, Wugu Township, Taipei County, TW;
Chen-Hsiang Lin, Wugu Township, Taipei County, TW;
Hwai-Ming Wang, Wugu Township, Taipei County, TW;
Ken Hsu, Wugu Township, Taipei County, TW;
Chih-Hung Cheng, Wugu Township, Taipei County, TW;
Golden Sun News Techniques Co., Ltd., Taipei County, TW;
CPUmate Inc, Taipei County, TW;
Abstract
A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.