The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2012
Filed:
Apr. 03, 2007
Lawrence W. Shacklette, Melbourne, FL (US);
Louis J. Rendek, West Melbourne, FL (US);
Paul B. Jaynes, Indialantic, FL (US);
Philip A. Marvin, Melbourne, FL (US);
Lawrence W. Shacklette, Melbourne, FL (US);
Louis J. Rendek, West Melbourne, FL (US);
Paul B. Jaynes, Indialantic, FL (US);
Philip A. Marvin, Melbourne, FL (US);
Harris Corporation, Melbourne, FL (US);
Abstract
A method for forming a circuit board is provided. The method includes forming a circuit board substrate () from a circuit board material. The method also includes positioning the circuit board substrate on a rigid structure () having a three dimensional contoured surface (). The method further includes applying heat and applying pressure to the circuit board substrate to at least partially conform the circuit board substrate to the three dimensional contoured surface. If the circuit board substrate () is a clad circuit board substrate, then a circuit pattern is formed on the circuit board substrate prior to the steps of applying heat and applying pressure. However, if the circuit board substrate () is an unclad circuit board substrate, then a circuit pattern is disposed on the circuit board substrate after the steps of applying heat and applying pressure.