The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2012
Filed:
Dec. 27, 2008
Kentaro Miyazato, Kirishima, JP;
Kazuki Hayata, Soraku-gun, JP;
Yuji Kishida, Soraku-gun, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
The invention relates to a high-frequency transmission line connection structure, a circuit board having the connection structure, a high-frequency module having the circuit board, and a radar apparatus. A first laminated waveguide sub-line part () includes a pair of main conductor layers that oppose each other in a thickness direction with a dielectric layer () having the same thickness as a dielectric layer () of a microstrip line () interposed therebetween. A second laminated waveguide sub-line part () includes dielectric layers () thicker than the dielectric layer of the first laminated waveguide sub-line part (). A laminated waveguide main-line part () includes dielectric layers () thicker than the dielectric layers of the second laminated waveguide sub-line part (). A conversion part () connected to the microstrip line () is formed by integrating with an upper main conductor layer constituting the respective line parts.