The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2012

Filed:

Apr. 17, 2008
Applicants:

Hironori Wakamatsu, Yokohama, JP;

Masanori Nakamura, Yokosuka, JP;

Masahiro Takaya, Yokosuka, JP;

Katsuo Suga, Yokohama, JP;

Hiroto Kikuchi, Hiratsuka, JP;

Jun Ikezawa, Yokosuka, JP;

Inventors:

Hironori Wakamatsu, Yokohama, JP;

Masanori Nakamura, Yokosuka, JP;

Masahiro Takaya, Yokosuka, JP;

Katsuo Suga, Yokohama, JP;

Hiroto Kikuchi, Hiratsuka, JP;

Jun Ikezawa, Yokosuka, JP;

Assignees:

Nissan Motor Co., Ltd., Yokohama-shi, JP;

RENAULT s.a.s., Boulogne-Billancourt, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 23/00 (2006.01); B01J 21/00 (2006.01); B01J 20/00 (2006.01); B01J 29/00 (2006.01); B01J 37/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A high heat-resistant catalyst includes: noble metal particles; first compounds which contact the noble metal particles and suppress movement of the noble metal particles; and second compounds which envelop the noble metal particles and the first compounds, suppress the movement of the noble metal particles, and suppress coagulation of the first compounds following mutual contact of the first compounds. The first compounds support the noble metal particles, and single piece or aggregate of the first compounds supporting the noble metal particles are included in a section partitioned by the second compounds. A coefficient of linear thermal expansion of the second compounds is 1.2×10[K] or less.


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