The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2012

Filed:

Feb. 24, 2010
Applicants:

Werner Hunziker, Stäfa, CH;

Felix Mayer, Stäfa, CH;

Inventors:

Werner Hunziker, Stäfa, CH;

Felix Mayer, Stäfa, CH;

Assignee:

Sensirion AG, Stäfa, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The flow sensor or other type of sensor comprises a package having a cylindrical section arranged between an anchor section and a head section. The diameter of the anchor section is typically larger than the diameter of the cylindrical section, which in turn is typically larger than the diameter of the head section. A sensor chip is embedded partially into the package, with a sensitive area being exposed to the surroundings. The sensor can e.g. be inserted into a bore having a diameter matching the one of the cylindrical section.


Find Patent Forward Citations

Hunziker, Werner. (2012). Sensor in a moulded package and a method for manufacturing the same (U.S. Patent No. 8156815). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8156815

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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