The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8156641 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 17, 2012

Filed:

May. 21, 2009
Applicants:

Dan Leo Massopust, Powell Butte, OR (US);

John Richard Andrews, Fairport, NY (US);

Chad J. Slenes, Sherwood, OR (US);

Inventors:

Dan Leo Massopust, Powell Butte, OR (US);

John Richard Andrews, Fairport, NY (US);

Chad J. Slenes, Sherwood, OR (US);

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

Exemplary embodiments provide interconnects and methods for interconnecting an electrical device array with a flexible circuit by filling a chemically-etched or laser-ablated integral stencil with conductive materials.


Find Patent Forward Citations

Massopust, Dan. (2012). Interconnection method for tightly packed arrays with flex circuit (U.S. Patent No. 8156641). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8156641

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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