The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2012
Filed:
Sep. 17, 2009
Applicants:
Goon Woo Kim, Cheonan-si, KR;
Whasu Sin, Cheonan-si, KR;
Jae Yong Park, Cheonan-si, KR;
Hwang-bok Ryu, Asan-si, KR;
Inventors:
Goon Woo Kim, Cheonan-si, KR;
Whasu Sin, Cheonan-si, KR;
Jae Yong Park, Cheonan-si, KR;
Hwang-Bok Ryu, Asan-si, KR;
Assignee:
Samsung Electronics Co., Ltd, Suwon-Si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An apparatus to manufacture a semiconductor package is provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside the apparatus. Thus, time required for a semiconductor packaging process decreases and yield is increased.