The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2012
Filed:
Mar. 09, 2010
Seong Min Cho, Gyunggi-do, KR;
Keung Jin Sohn, Gyunggi-do, KR;
Tae Kyun Bae, Gyunggi-do, KR;
Hyun Jung Hong, Gyunggi-do, KR;
Kyung Ah Lee, Seoul, KR;
Chang Gun OH, Gyunggi-do, KR;
Seong Min Cho, Gyunggi-do, KR;
Keung Jin Sohn, Gyunggi-do, KR;
Tae Kyun Bae, Gyunggi-do, KR;
Hyun Jung Hong, Gyunggi-do, KR;
Kyung Ah Lee, Seoul, KR;
Chang Gun Oh, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, Gyunggi-Do, KR;
Abstract
Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.