The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8155774 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 10, 2012

Filed:

Nov. 05, 2007
Applicants:

Jeng-feng Wu, Chiayi County, TW;

Chia-chen Chen, Hsinchu, TW;

Hsien-chang Lin, Taipei, TW;

Inventors:

Jeng-Feng Wu, Chiayi County, TW;

Chia-Chen Chen, Hsinchu, TW;

Hsien-Chang Lin, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A 3D object fabrication method implemented in a fabrication system includes the following steps. A digital object model is retrieved. Sections of the digital object model are respectively printed on plural pieces of plane material. The pieces of plane material are combined to form a physical 3D object of the digital object model.


Find Patent Forward Citations

Wu, Jeng-Feng. (2012). 3d object fabrication methods and systems (U.S. Patent No. 8155774). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8155774

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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