The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2012
Filed:
Sep. 29, 2008
Kenneth Lee Hauenstein, Seneca Falls, NY (US);
Douglas Paddock, Penn Yan, NY (US);
Mark Alexander Playford, Seneca Falls, NY (US);
Jermiah Dennis Quill, Cayuga, NY (US);
David A. Rice, Syracuse, NY (US);
Patrick J. Brusa, Syracuse, NY (US);
Kenneth Lee Hauenstein, Seneca Falls, NY (US);
Douglas Paddock, Penn Yan, NY (US);
Mark Alexander Playford, Seneca Falls, NY (US);
Jermiah Dennis Quill, Cayuga, NY (US);
David A. Rice, Syracuse, NY (US);
Patrick J. Brusa, Syracuse, NY (US);
ITT Manufacturing Enterprises, Inc., Wilmington, DE (US);
Abstract
The present invention provides a new and unique method and apparatus for monitoring a device, such as a pump. The device may also include a fan, compressor, turbine or other rotating or reciprocating piece of machinery. In one embodiment, the method features sensing in a first device both a start-up vibration at a start-up time after the first device is affixed to a second device to be monitored and a subsequent vibration level at a subsequent time after the start-up time, and providing both a start-up vibration level signal containing information about the start-up vibration level of the second device, and a subsequent vibration level signal containing information about the subsequent vibration level of the second device; and monitoring in the first device the condition of operation of the second device based on a comparison of the start-up vibration level signal in relation to the subsequent vibration level signal. The apparatus may take the form of one or more modules and/or chipset for performing the steps and functionality of the aforementioned method.