The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2012
Filed:
Feb. 18, 2010
Shigeru Kondou, Osaka, JP;
Yoshihiro Tomura, Osaka, JP;
Shigeru Kondou, Osaka, JP;
Yoshihiro Tomura, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A solder bump and a conductive connection structure are provided which can conductively connect a semiconductor chip and a substrate with high connection reliability. Filleris contained in a solder bumpand a solder jointwhich connect a connection electrodeof a semiconductor chipand a substrate, and the filler has a larger density on the side of the connection electrodethan on the side of the substratein the solder joint. Therefore, in the cooling solidification of solder, the shrinkage of the solder jointnear the connection electrodeof the semiconductor chipis reduced by the fillerand the occurrence of a stress is reduced on the peripheral portion of the connection electrode, thereby preventing the occurrence of cracks near the joint.