The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2012
Filed:
Dec. 31, 2008
Stefan W. Wiktor, Raleigh, NC (US);
Vladimir A. Muratov, Manchester, NH (US);
Anthony L. Coyle, Parker, TX (US);
Bernhard P. Lange, Freising, DE;
Stefan W. Wiktor, Raleigh, NC (US);
Vladimir A. Muratov, Manchester, NH (US);
Anthony L. Coyle, Parker, TX (US);
Bernhard P. Lange, Freising, DE;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
An integrated circuit (IC) includes a substrate having a semiconducting surface, a first array of devices on and in the semiconducting surface including first and second coacting current conducting nodes, a plurality of layers disposed on the substrate and including at a electrically conductive layers and dielectric layer, and a plurality of bump pads on or in the top surface of the dielectric layers. In the IC, the electrically conductive layers define electrical traces, where a first portion of the electrical traces contact a first portion of the bump pads exclusively to a portion of the first coacting current conducting nodes, where a second portion of the electrical traces contact a second portion of the bump pads exclusively to a portion of the second coacting current conducting nodes, and where the electrical traces are electrically isolated from one another by the dielectric layers.