The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2012
Filed:
Nov. 02, 2006
Masamichi Ishihara, Kitakyushu, JP;
Harufumi Kobayashi, Tokyo, JP;
Masamichi Ishihara, Kitakyushu, JP;
Harufumi Kobayashi, Tokyo, JP;
Oki Semiconductor Co., Ltd, Tokyo, JP;
Abstract
A dual-face package has an LSI chip sealed with a mold resin, and electrodes for external connections on both of the front face and the back face. The LSI chip is bonded onto the die pad of a leadframe whose outer lead portions are exposed as back-face electrodes at least the back face. The LSI chip and a plurality of inner lead portions of the leadframe are connected by wiring. At least some of the plurality of inner lead portions have front-face electrodes integrally formed by working a portion of the leadframe. Head faces of the front-face electrodes, or bump electrodes connected to the respective head faces of the front-face electrodes serve as electrodes for external connections to another substrate, element, or the like.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile