The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2012
Filed:
Mar. 05, 2009
Shuji Yoneda, Kagoshima, JP;
Masato Oishi, Kanagawa, JP;
Tamotsu Shinohara, Kagoshima, JP;
Shinji Watanabe, Kagoshima, JP;
Koji Miyata, Kagoshima, JP;
Seiji Fukae, Kagoshima, JP;
Kenji Yamauchi, Kagoshima, JP;
Yoichi Goto, Kagoshima, JP;
Masakazu Baba, Kagoshima, JP;
Shuji Yoneda, Kagoshima, JP;
Masato Oishi, Kanagawa, JP;
Tamotsu Shinohara, Kagoshima, JP;
Shinji Watanabe, Kagoshima, JP;
Koji Miyata, Kagoshima, JP;
Seiji Fukae, Kagoshima, JP;
Kenji Yamauchi, Kagoshima, JP;
Yoichi Goto, Kagoshima, JP;
Masakazu Baba, Kagoshima, JP;
Sony Corporation, Tokyo, JP;
Abstract
A method for manufacturing a semiconductor device, includes the steps of: forming a resin layer on an upper surface of a substrate including a photodiode such that the resin layer does not cover a light receiving region of the photodiode; forming at least one groove in the resin layer so as to surround the light receiving region; and subsequently mold-sealing the photodiode by loading the substrate into a mold and filling the mold with a molding resin.