The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2012
Filed:
Mar. 13, 2008
Applicants:
Eckhard Ditzel, Linsengericht, DE;
Siegfried Walter, Gelnhausen-Höchst, DE;
Manfred Gresch, Neu-Anspach, DE;
Inventors:
Eckhard Ditzel, Linsengericht, DE;
Siegfried Walter, Gelnhausen-Höchst, DE;
Manfred Gresch, Neu-Anspach, DE;
Assignee:
W.C. Heraeus GmbH, Hanau, DE;
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/24 (2006.01); B65D 85/90 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: