The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8151649 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 10, 2012

Filed:

May. 28, 2010
Applicants:

Masashi Totokawa, Nagoya, JP;

Masao Naito, Nagoya, JP;

Akihiro Takeichi, Aichi-ken, JP;

Inventors:

Masashi Totokawa, Nagoya, JP;

Masao Naito, Nagoya, JP;

Akihiro Takeichi, Aichi-ken, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 1/00 (2006.01); G01L 1/22 (2006.01); H01C 10/10 (2006.01); H01C 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A physical quantity sensor device () having a structure in which a stress-sensitive body () of which the electric characteristics vary depending upon the application of stress and an insulator () having electric insulation are formed being closely adhered together, wherein the stress-sensitive body () comprises a thin glass film containing an electrically conductive element that is solidly dissolved therein as atoms, a method of manufacturing the physical quantity sensor device, a piezo-resistive film comprising a thin glass film containing ruthenium that is solidly dissolved therein as atoms, and a method of manufacturing the piezo-resistive film.


Find Patent Forward Citations

Totokawa, Masashi. (2012). Physical quantity sensor device and method of manufacturing the same (U.S. Patent No. 8151649). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8151649

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