The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2012
Filed:
Mar. 14, 2008
Jee-soo Mok, Yongin-si, KR;
Je-gwang Yoo, Yongin-si, KR;
Yoong OH, Suwon-si, KR;
Jong-seok Bae, Busan, KR;
Chang-sup Ryu, Yongin-si, KR;
Jee-Soo Mok, Yongin-si, KR;
Je-Gwang Yoo, Yongin-si, KR;
Yoong Oh, Suwon-si, KR;
Jong-Seok Bae, Busan, KR;
Chang-Sup Ryu, Yongin-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
An apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.