The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
Dec. 14, 2009
Patrizio Vinciarelli, Boston, MA (US);
Claudio Tuozzolo, Johnston, RI (US);
Patrizio Vinciarelli, Boston, MA (US);
Claudio Tuozzolo, Johnston, RI (US);
Picor Corporation, North Smithfield, RI (US);
Abstract
A package for one or more semiconductor die is described. A generally rectangular package includes two large terminals that occupy substantially the entire length of the package and provide low resistance connections. Additional connections may be provided preferably in a central portion of a short end of the package. BGA connections between the semiconductor die and the package substrate provide low impedance connections between the die and the package contacts. The package and connections facilitate current flow orthogonal to the longest package dimension maximizing conductor width and minimizing interconnection resistance.