The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
Mar. 06, 2006
Tomoharu Horio, Kyoto, JP;
Yuki Tanuma, Kyoto, JP;
Satoshi Nakamura, Kyoto, JP;
Kazumi Morimoto, Kyoto, JP;
Tomoharu Horio, Kyoto, JP;
Yuki Tanuma, Kyoto, JP;
Satoshi Nakamura, Kyoto, JP;
Kazumi Morimoto, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
An infrared data communication module (A) includes a substrate () consisting of a first layer (A) and a second layer (B), where the first layer is formed with a recess () open at its obverse surface, and includes the opening of the recess () and the second layer is fixed to the first layer (A) on the side opposite from the opening. The module also includes a bonding conductor layer (A) covering at least the bottom surface of the recess (), a light emitting element () mounted on the bonding conductor layer (A), and a heat dissipating conductor layer (C) sandwiched between the first layer (A) and the second layer (B) and connected to the bonding conductor layer (A).