The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
Aug. 01, 2007
Souhei Samejima, Chiuyoda-ku, JP;
Sadao Sato, Chiyoda-ku, JP;
Hiroyuki Osuga, Chiyoda-ku, JP;
Shigeru Utsumi, Chiyoda-ku, JP;
Teruhiko Kumada, Chiyoda-ku, JP;
Souhei Samejima, Chiuyoda-ku, JP;
Sadao Sato, Chiyoda-ku, JP;
Hiroyuki Osuga, Chiyoda-ku, JP;
Shigeru Utsumi, Chiyoda-ku, JP;
Teruhiko Kumada, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs () and () being cured after each covering the surfaces of a metal plate () provided with first throughholes () therein and the inner walls of the first throughholes (); prepregs () and () being cured after glass clothes () and () are sandwiched between the prepregs () and (), and the prepregs () and (), respectively; and second throughholes () that connect wiring layers () and (), and () and () provided on both surfaces of prepregs () and (), respectively. The prepregs () and () and the prepregs () and () are characterized in that they contain inorganic filler. Furthermore, the prepregs () and () and the prepregs () and () may contain elastomer.