The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
Oct. 07, 2009
Kana Akeda, Aichi, JP;
Koji Terada, Aichi, JP;
Kana Akeda, Aichi, JP;
Koji Terada, Aichi, JP;
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Abstract
Disclosed are a reactive hot melt adhesive composition having no problem in the initial adhesive strength, the adhesive strength obtained after moisture curing, stringiness and the like, and a method for producing the same. In the method, 1 to 50 parts by mass of a polymer (A), which is obtained by polymerization of a monomer composition including a vinyl monomer having a carboxyl group and a vinyl monomer having an epoxy group and has the equivalent ratio of the carboxyl group to the epoxy group in the range of 1/100 to 100/1, is mixed with 99 to 50 parts by mass in total of a polyisocyanate (B) and a polyol (C) so that the amount of the isocyanate group can become 1.1 to 10 moles relative to 1 mole of the hydroxyl group of the polyol (C), the sum of the components (A) to (C) being 100 parts by mass, and the resulting mixture is heated and mixed.