The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
Jun. 20, 2006
Masao Furukawa, Yokohama, JP;
Yuji Tsuruoka, Kawasaki, JP;
Takashi Mori, Tokyo, JP;
Nobuhito Yamaguchi, Tokyo, JP;
Seiichi Kamiya, Yokohama, JP;
Masao Furukawa, Yokohama, JP;
Yuji Tsuruoka, Kawasaki, JP;
Takashi Mori, Tokyo, JP;
Nobuhito Yamaguchi, Tokyo, JP;
Seiichi Kamiya, Yokohama, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A circuit pattern forming method that can reduce a possibility of undesired short-circuits being produced in the circuit by satellites formed when fabricating a conductive pattern. Thereby, a highly reliable printed circuit board can be formed. A conductive pattern and an insulating pattern of a predetermined thickness are overlappingly drawn by scanning a liquid ejection head and a substrate relative to each other a plurality of times, while ejecting droplets of a conductive pattern forming solution and an insulating pattern forming solution. When forming the conductive pattern and the insulating pattern that adjoin each other on the substrate, the step of forming the insulating pattern of at least one scan is executed between the conductive pattern forming steps that are executed the plurality of times, until the conductive pattern has a predetermined thickness.