The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
Mar. 12, 2008
John L. Shipley, Tremonton, UT (US);
Jerry W. Jenson, Thatcher, UT (US);
Mark R. Eggett, Brigham City, UT (US);
John L. Shipley, Tremonton, UT (US);
Jerry W. Jenson, Thatcher, UT (US);
Mark R. Eggett, Brigham City, UT (US);
Alliant Techsystems Inc., Arlington, VA (US);
Abstract
Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include heating a sensor that is operably coupled to a measuring circuit and then measuring an output signal over time. The method may further include determining, from the output signal, a percentage of bond integrity remaining between the sensor and the structure. A system may include a measurement circuit having a sensor operably coupled to a sensing system. The sensing system may be configured for applying a thermal shock to the sensor and subsequently measuring an output signal of the measuring circuit. The sensing system may also be configured for determining, from the output signal, an amount of bond between the sensor and the structure.