The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2012

Filed:

Sep. 16, 2009
Applicants:

Sin-heng Lim, Singapore, SG;

Amy GE, Tianjin, CN;

Inventors:

Sin-Heng Lim, Singapore, SG;

Amy Ge, Tianjin, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for packaging the sensor units is shown below. First step is providing a substrate, and each sensor area on the substrate is partitioned into two individual circuit areas. An emitter and a detector are installed on the two circuit areas respectively. Step two is forming a first packaging structure to cover the two circuit areas, the emitter and the detector by a mold. Next step is cutting the first packaging structure to form cut groove between and around the emitter and the detector. Next step is forming a second packaging structure in the cut grooves by the same mold. At last, the panel of sensor units is diced and separated as individual sensor units. As above-mentioned, the second packaging structure is used for isolating the signals of the emitter and the detector.


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