The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2012

Filed:

Jul. 21, 2008
Applicants:

Qingfang Yao, Valencia, CA (US);

Jordan Matthew Neysmith, Pasadena, CA (US);

Neil Hamilton Talbot, La Crescenta, CA (US);

James Singleton Little, Saugus, CA (US);

Robert J. Greenberg, Los Angeles, CA (US);

Inventors:

Qingfang Yao, Valencia, CA (US);

Jordan Matthew Neysmith, Pasadena, CA (US);

Neil Hamilton Talbot, La Crescenta, CA (US);

James Singleton Little, Saugus, CA (US);

Robert J. Greenberg, Los Angeles, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer. The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate. The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.


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