The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
Dec. 31, 2009
Applicant:
Dai Motojima, Kyoto, JP;
Inventor:
Dai Motojima, Kyoto, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device includes a first interconnect; a second interconnectwhich is formed in a different interconnect layer from that of the first interconnect, and which has a wider line width than that of the first interconnect; and first and second plugsandwhich are formed in a region where the first and second interconnectsandextend in the same direction so as to overlap one above the other, and which electrically connect the first and second interconnectsand. The first plughas a larger base area than that of the second plug, and is formed on an end side of the first interconnectwith respect to the second plug