The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
Apr. 30, 2010
Yin-cheng Chao, Sanxia Township, Taipei County, TW;
Yu-bing Lan, Banciao, TW;
Pei-hsuan Lan, Banciao, TW;
Jui-hung Chen, Taoyuan, TW;
Yin-Cheng Chao, Sanxia Township, Taipei County, TW;
Yu-Bing Lan, Banciao, TW;
Pei-Hsuan Lan, Banciao, TW;
Jui-Hung Chen, Taoyuan, TW;
Abstract
A process for manufacturing an LED package structure includes the following steps: (A) providing a T-shaped heat-sink block and an integral material sheet, wherein the T-shaped heat-sink block includes a base portion and a rise portion extending from the base portion, and wherein the integral material sheet includes a side frame and a pair of electrode lead frames extending, respectively, from two opposite internal sides of the side frame; (B) forming an insulating layer on an upper surface of the base portion; (C) disposing the electrode lead frames on the insulating layer; and (D) forming an insulating outer frame around the T-shaped heat-sink block, wherein the insulating layer is enveloped in the insulating outer frame, and part of the base portion of the heat-sink block exposes out of the insulating outer frame. As a result, the LED package structure can improve voltage resistance and insulation.