The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
Apr. 08, 2009
Huang Detian, Tokyo, JP;
Hiromitsu Kuroda, Tokyo, JP;
Hakaru Matsui, Tokyo, JP;
Osamu Seya, Tokyo, JP;
Ryohei Okada, Tokyo, JP;
Shinichi Masui, Tokyo, JP;
Ryuji Nakagawa, Tokyo, JP;
Hiroshi Okikawa, Tokyo, JP;
Huang Detian, Tokyo, JP;
Hiromitsu Kuroda, Tokyo, JP;
Hakaru Matsui, Tokyo, JP;
Osamu Seya, Tokyo, JP;
Ryohei Okada, Tokyo, JP;
Shinichi Masui, Tokyo, JP;
Ryuji Nakagawa, Tokyo, JP;
Hiroshi Okikawa, Tokyo, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
An extra-fine copper alloy twisted wire including a plurality of copper alloy wires with a wire diameter of 0.010 to 0.025 mm twisted together, each of the copper alloy wires including 1 to 3 weight % of silver (Ag) and a balance consisting of a copper and an inevitable impurity, the copper alloy twisted wire further including a tensile strength of not less than 850 MPa, and an electrical conductivity of not less than 85% IACS. The extra-fine copper alloy twisted wire includes a solid insulation with a thickness of not more than 0.07 mm formed on an outer circumference of the extra-fine insulated wire.