The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2012

Filed:

Dec. 04, 2008
Applicants:

Toshio Isozaki, Ichihara, JP;

Kouji Satou, Ichihara, JP;

Takayoshi Tanaka, Ichihara, JP;

Inventors:

Toshio Isozaki, Ichihara, JP;

Kouji Satou, Ichihara, JP;

Takayoshi Tanaka, Ichihara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 9/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a polycarbonate resin composition which contains specific amounts of a glass filler and glossy particles, which can be molded into an article in which no difference in lightness is visually observed between the left side and the right side of the weld line, and which has excellent optical properties and flame retardancy. The polycarbonate resin composition contains: a composition formed of an aromatic polycarbonate resin (A) and a glass filler (B) having a difference in refractive index 0.002 or less from the aromatic polycarbonate resin of; glossy particles (C-1) having an average particle diameter of 10 μm or more and less than 50 μm; glossy particles (C-2) having an average particle diameter of 50 to 300 μm; a silicone compound (D) having a reactive functional group; and an organic alkali metal salt compound and/or an organic alkali earth metal salt compound (E). Also provided are a polycarbonate resin molded article produced by molding the resin composition, and a method of producing a polycarbonate resin molded article, which is characterized by involving subjecting the resin composition to an injection molding at a mold temperature of 120° C. or higher.


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