The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
Sep. 09, 2010
Raymond W. Engel, Southbridge, MA (US);
Nirmal Sharma, Shrewsbury, MA (US);
William P. Taylor, Amherst, NH (US);
Raymond W. Engel, Southbridge, MA (US);
Nirmal Sharma, Shrewsbury, MA (US);
William P. Taylor, Amherst, NH (US);
Allegro Microsystems, Inc., Worcester, MA (US);
Abstract
Methods for providing an integrated circuit using a multi-stage molding process to protect wirebonds. In one embodiment, a method includes attaching a die to a leadframe having a lead finger, attaching a wirebond between the die and the leadfinger, applying a first mold material over at least a portion of the wirebond and the die and the leadfinger to form an assembly, waiting for the first mold material to at least partially cure, and applying a second mold material over the assembly.