The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
May. 05, 2009
Seung Wook Park, Suwon-si, KR;
Jin Gu Kim, Suwon-si, KR;
Jong Hwan Baek, Seoul, KR;
Jong Yun Lee, Incheon-si, KR;
Hyung Jin Jeon, Gunpo-si, KR;
Young DO Kweon, Seoul, KR;
Seung Wook Park, Suwon-si, KR;
Jin Gu Kim, Suwon-si, KR;
Jong Hwan Baek, Seoul, KR;
Jong Yun Lee, Incheon-si, KR;
Hyung Jin Jeon, Gunpo-si, KR;
Young Do Kweon, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
The present invention relates to a method of manufacturing a semiconductor package capable of simplifying a process and remarkably reducing a production cost by including the steps of: preparing a different bonded panel including at least one metal layer; forming a pad unit electrically connected to the metal layer; mounting a semiconductor chip over the different bonded panel to be electrically connected to the pad unit; sealing the semiconductor chip; forming a rearrangement wiring layer by etching the metal layer; and forming an external connection unit electrically connected to the rearrangement wiring layer.