The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2012

Filed:

Dec. 26, 2006
Applicant:

Yasuyuki Yoshino, Chiba, JP;

Inventor:

Yasuyuki Yoshino, Chiba, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/34 (2006.01); B32B 27/08 (2006.01); B32B 5/16 (2006.01); B29B 7/48 (2006.01); C08J 3/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a heat-resistant resin composition which has excellent heat resistance, does not show a reduced mechanical strength such as flexural strength even after being passed rough a reflow furnace and heat-treated under high temperature conditions, and also has an excellent flame retardancy; a production method of the heat-resistant resin composition; a heat-resistant resin-molded article; and a surface mount electronic component. The heat-resistant resin composition includes a polyarylene sulfide resin (A) and an aromatic polyamide (B) having terephthalic acid amide as an essential structural unit at a former/latter ratio of 70/30 to 95/5 by mass. In a molded article composed of the heat-resistant resin composition, the average diameter of holes formed by etching a broken-out section of the molded article with an organic solvent is 0.1 to 1.0 μm, where the broken-out section is observed on a scanning electron microscope (2,500 times).


Find Patent Forward Citations

Yoshino, Yasuyuki. (2012). Heat-resistant resin composition, method of producing the same, heat-resistant resin-molded article, and surface mount electronic component (U.S. Patent No. 8142899). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8142899

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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