The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
Sep. 17, 2008
Garo Miyamoto, Ushiku, JP;
Garo Miyamoto, Ushiku, JP;
Nippon Mektron, Ltd., Tokyo-To, JP;
Abstract
A method for manufacturing a printed-wiring board having an organic resin insulating layer and a metal wiring layer and having a film-like resistive element formed on the metal wiring layer thereof, the method including: disposing a metal wiring layer on one surface of one organic resin insulating layerto form an organic resin printed-wiring board; forming a pair of electrodeson the metal wiring layer of the organic resin printed-wiring board; forming a film-like resistive elementbetween the electrodes; applying a temperature and a pressure of a laminating press to the side of the metal wiring layer in the wiring board without use of a laminating adhesive agent to change a resistance value of the film-like resistive element; trimming the film-like resistive element for adjusting a resistance value; providing a circuit memberhaving at least one layer of insulating layer; and laminating the circuit member with a laminating adhesive agentin between so as to contact with a layer of the organic resin printer-circuit board having the film-like resistive element formed thereon. Accordingly, the present invention provides a method for manufacturing a printed-wiring board with built-in resistive element formed by resistive paste with high accuracy and high yield at low cost.