The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Jul. 13, 2008
Guu Lin, San Jose, CA (US);
Yen-fu Lin, San Jose, CA (US);
Stephanie T. Tran, San Jose, CA (US);
Pooyan Khoshkhoo, Santa Clara, CA (US);
Guu Lin, San Jose, CA (US);
Yen-Fu Lin, San Jose, CA (US);
Stephanie T. Tran, San Jose, CA (US);
Pooyan Khoshkhoo, Santa Clara, CA (US);
Altera Corporation, San Jose, CA (US);
Abstract
A circuit can include a module having signal pads that are configurable to route signals between the circuit and at least one external device. The module can also have unused pads that are interleaved between the signal pads. A circuit can include a module having signal pads that are configurable to route varying signals between the circuit and at least one external device. The module can also have voltage pads that are configurable to route substantially constant voltages between at least one external device and the circuit. The signal pads can be interleaved between the voltage pads. A module with one or more of these features can achieve ideal performance in both wire bond and flip chip packages with the flexibility of setting a different input/output utilization percentage within the module.