The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Sep. 12, 2008
Yukitsuna Konishi, Otsu, JP;
Hirohumi Tsuchiya, Otsu, JP;
Shinsuke Kimura, Otsu, JP;
Yasushi Sawamura, Otsu, JP;
Yukitsuna Konishi, Otsu, JP;
Hirohumi Tsuchiya, Otsu, JP;
Shinsuke Kimura, Otsu, JP;
Yasushi Sawamura, Otsu, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
In order to provide an adhesive composition for electronic components that is excellent in adhesion durability under long-term high temperature conditions, thermal cyclability, and insulation reliability, designed is an adhesive composition for electronic components containing a thermoplastic resin (a), an epoxy resin (b), a hardener (c), and an organopolysiloxane (d), wherein the glass transition temperature (Tg) after curing is −10° C. to 50° C. and the rate of change of Tg after heat-treating the composition at 175° C. for 1000 hours is 15% or less.