The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8138509 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 20, 2012

Filed:

Feb. 27, 2009
Applicants:

Tzy-ying Lin, Hsinchu, TW;

Chun-chiang Yen, Hsinchu, TW;

Wu-cheng Kuo, Hsinchu, TW;

Inventors:

Tzy-Ying Lin, Hsinchu, TW;

Chun-Chiang Yen, Hsinchu, TW;

Wu-Cheng Kuo, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/36 (2010.01);
U.S. Cl.
CPC ...
Abstract

Light emitting devices conformally covered by a luminescent material layer are presented. A light emitting device includes a semiconductor light emitting die attached to a substrate. At least one bond pad is disposed on the semiconductor light emitting die. A luminescent material layer conformally covers the semiconductor light emitting die, wherein the luminescent material layer has at least one opening corresponding to and exposing the at least one bond pad. At least one wirebond is electrically connected to the at least one bond pad and a contact pad on the substrate.


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Lin, Tzy-Ying. (2012). Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate (U.S. Patent No. 8138509). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8138509

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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